Industrial Magnetron Sputtering Equipment
The equipment is mainly composed of a process chamber, an sampling chamber, a transmission system and a transmission platform. Among them, the process module is used to provide the environment for the substrate process. It can be used in micro and nano devices, laser devices, power devices, MEMS and so on.
Advantages
Expandable module design, patented architecture design, effectively improve production capacity and ensure coating quality
Unique airflow design, coating to maintain good uniformity
Technical Parameter
| Exhaust rate | From ATM to (8E-04) Pa ≤ 20min (loadlock) |
| Wafer heating | Maximum temperature of 500 ℃, temperature control error ± 1 ℃ |
| Ion beam cleaning | Kaufman ion source 100-600eV, 100-1200eV; The uniformity of etching on a substrate with a diameter of 100 is less than ± 6% |
| Wafer adjustment | The distance between the substrate and the target material can be continuously adjusted |
| Wafer Transfer | Highly Reliable and Repeatable Wafer Transfer Capability |
| Control system | Fully automated human-machine interface |
| Safety | Industrial standard safety interlock, alarm |
