Electron Beam Evaporation Equipment
This electron beam evaporation system can achieve accurate multi-layer thin film deposition in ultra-high vacuum environment, and a linear electron beam gun can achieve evaporation of various materials. The equipment can be equipped with a Kauffman ion source to achieve wafer pre-cleaning. it can be used in fields such as superconducting quantum, and is suitable for research and development in universities and enterprises, as well as small-scale production occasions.
Advantages
Limiting Vacuum: Better than 1×10^-7 mbar
Wafer Cleaning: Optional Kaufman ion source for wafer cleaning
Thickness Monitoring: Equipped with a film thickness gauge for real-time monitoring of thin film thickness
Continuous Growth: Multi-crucible rotating electron beam gun for continuous growth of multi-layer thin films
Heating System: Equipped with a heating system, enabling adjustable thin film growth temperatures from RT to 800°C
Superior Uniformity: Deposition uniformity better than ±3%
Technical Parameter
Wafer size | 4inch-8inch |
Extreme vacuum | Better than 1×10^-7 mbar |
Electron beam gun | Ultra high vacuum linear mothion electron beam gun, optional with crucible quantity and capacity (standard, 10KW, 6x15cc) |
Wafer cleaning | Optional Kauffman ion source for wafer cleaning |
Uniformity | 4-inch wafers are better than ±3% |
Control system | PC+PLC, Fully antomatic operation and safety interlock |
Manipulator | 180 degree tilt, 360 degree rotation, optional lifting and bias voltage. Film thickness measurement: QCM, telescopic |
Demension | 3m*2m*2m (L*W*H) |
Options | Cryogenic pump, automatic transfer, process menu etc |
